INTEGRATED CIRCUITS

Objective Questions

Short notes

Objective questions (Answers are given below)

  1. First integrated circuit chip was developed by
    (a) C.V. Raman
    (b) W.H. Brattain
    (c) J.S. Kilby
    (d) Robert Noyce.
  2. An integrated electronic circuit is
    (a) a complicated circuit
    (b) an integrating device
    (c) much costlier than a single transistor
    (d) fabricated on a tiny silicon chip.
  1. Most important advantage of an IC is its
    (a) easy replacement in case of circuit failure
    (b) extremely high reliability
    (c) reduced cost
    (d) low power consumption.
  2. In monolithic ICs, all components are fabricated
    by …………… process.
    (a) evaporation
    (b) sputtering
    (c) diffusion
    (d) oxidisation.
  3. Monolithic ICs are fabricated within a
    (a) soft stone
    (b) single stone
    (c) silicon layer
    (d) ceramic base.
  4. As compared to monolithic ICs, film ICs have
    the advantage of
    (a) better high-frequency response
    (b) much reduced cost
    (c) smaller size
    (d) less flexibility in circuit design.
  5. Monolithic technique is ideally suited for fabricating
    …………… ICs.
    (a) thin-film
    (b) digital
    (c) linear
    (d) thick-film
  6. In the context of IC fabrication, metallisation
    means
    (a) connecting metallic wires
    (b) forming interconnecting conduction pattern
    and bonding pads
    (c) depositing SiO2 layer
    (d) covering with a metallic cap.
  7. Monolithic transistors are formed in the epitaxial
    N-layer
    (a) in one operation
    (b) by evaporation process
    (c) by successive impurity diffusions
    (d) by oxidisation.
  8. The major component of a MOS IC is a/an
    (a) FET (b) MOSFET
    (c) BJT (d) SCR.
  9. Processing of MOS ICs is less expensive than
    bipolar ICs primarily because they
    (a) use cheaper components
    (b) need no component isolation
    (c) require much less diffusion steps
    (d) have very high packing density.
  10. In an integrated circuit, the SiO2 layer provides
    (a) electrical connection to the external circuit
    (b) physical strength
    (c) isolation
    (d) conducting path.
  11. The foundation on which an IC is built is called
    an
    (a) insulator (b) base
    (c) wafer (d) plate
  12. Monolithic IC construction uses
    (a) discrete components
    (b) high-value resistors
    (c) connecting wires
    (d) extensive number of components
  1. (c) 2. (d) 3. (b) 4. (c) 5. (c) 6. (a) 7. (b) 8. (b) 9. (c) 10. (b) 11. (c) 12. (c) 13.(c) 14. (d)

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